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Vitrified Bond Diamond Grinding Wheel for Back Thinning Semiconductor Materials

Henan, ChinaHenan E-Grind Abrasives Co., Ltd.

Vitrified Bond Diamond Grinding Wheel for Back Thinning Semiconductor Materials

US$1,800.00-2,000.00

1 piece

Sample price:US$2000.00/piece.Request sample

Product profile

Customization

Available

Manufacturing Process

Sintered

Shape

6A2t

Model NO.

6A2T

Bonding Agent

Resin Bond or Vitrified Bond

Application

Back Thinning Wafer Such as Silicon, Silicon Carbi

Grain Size

D320# - 6000#

Concentration

100% - 150%

Hardness

Soft / Medium / Hard

Certification

ISO9001, CE, SGS

Types

Back Thinning Grinding Wheel

Transport Package

Box

Specification

Diamond, CBN

Trademark

E-Grind

Origin

China

HS Code

68042210

Production Capacity

50000PCS/Year

Key features

Customizable Dimensions: Bore diameter and thickness are fully customizable to meet specific requirements.

Wide Grit Range: Available in grit sizes from D320# to 6000# for various precision needs.

Multiple Bond Options: Offers both Resin and Vitrified bonds for different grinding applications.

High Precision Grinding: Designed for high precision with stable performance and minimal loading.

Fast Delivery: Ensures fast delivery within 20 to 45 days for mass production needs.

ISO9001 Certified: Manufactured on an ISO9001 standardized production line with strict quality control.

Advanced Technology: Uses high-quality synthetic diamond powder and advanced hot-pressing sintering.

24/7 Technical Support: Provides 24-hour online technical support for all customers.

Company profile

Henan E-Grind Abrasives Co., Ltd.

Importers and ExportersFast DeliveryLow MOQHigh Repeat Buyers Choice

Henan E-Grind Abrasives Co., Ltd.

Henan, China

Business Type: Manufacturer/FactoryExport Year: 2009-06-12Average Response Time: ≤2.75h

About Our Factory & Business Background

Address1841&1842, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou, Henan, China

Our Production Capability & Technical Expertise

Main ProductsDiamond/CBN Grinding Wheels, PDC PCD, Synthetic Diamond Powder, CBN, Sharpening Stone, Conventional Abrasives and Tools

Product Q&A

Q:What is the grit size range available?

A:

The grit size ranges from D320# to 6000#.

Q:Can the bore diameter and thickness be customized?

A:

Yes, both the bore diameter and thickness are customizable.

Q:What bond types are available for this wheel?

A:

We offer both Resin Bond and Vitrified Bond options.

Q:What is the delivery time for orders?

A:

Fast delivery is available within 20-45 days.

Q:Do you provide OEM and ODM services?

A:

Yes, we provide OEM and ODM customized services.

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