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Vitrified Bond Diamond Grinding Wheel for Back Thinning Semiconductor Materials
US$1,800.00-2,000.00
1 piece
Sample price:US$2000.00/piece.Request sample
Product profile
Customization
AvailableManufacturing Process
SinteredShape
6A2tModel NO.
6A2TBonding Agent
Resin Bond or Vitrified BondApplication
Back Thinning Wafer Such as Silicon, Silicon CarbiGrain Size
D320# - 6000#Concentration
100% - 150%Hardness
Soft / Medium / HardCertification
ISO9001, CE, SGSTypes
Back Thinning Grinding WheelTransport Package
BoxSpecification
Diamond, CBNTrademark
E-GrindOrigin
ChinaHS Code
68042210Production Capacity
50000PCS/YearCompany profile
Business Type: Manufacturer/FactoryExport Year: 2009-06-12Average Response Time: ≤0.41h
About Our Factory & Business Background
Address1841&1842, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou, Henan, China
Our Production Capability & Technical Expertise
Main ProductsDiamond/CBN Grinding Wheels, PDC PCD, Synthetic Diamond Powder, CBN, Sharpening Stone, Conventional Abrasives and Tools
Send Inquiry
*To:
Henan E-Grind Abrasives Co., Ltd.
Henan E-Grind Abrasives Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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