Advanced Via Technology: Features blind/buried vias, HDI micro vias, and via-in-pad with solid copper filling.
Heavy Copper Capability: Capable of manufacturing heavy-copper boards up to 12oz.
Large Board Dimensions: Maximum board thickness up to 6.5mm and size up to 1010x610mm.
Wide Material Selection: Processes FR4, PTFE, Rogers, Arlon, ceramics, Alu/Copper base, PI, and BT materials.
Strict Quality Standards: Manufactured to strict UL and IPC standards using state-of-the-art equipment.
Fast Delivery Service: PCB build time as fast as 2-3 days with 12-hour and 24-hour express options.
Full Turnkey PCBA: Includes fabrication, component procurement, and assembly for one-stop efficiency.