Advanced Via Technology: Supports blind/buried vias, HDI micro vias, and via-in-pad with filled vias.
Heavy Copper Capability: Capable of manufacturing heavy-copper boards up to 12oz thickness.
Wide Material Selection: Processes FR4, Rogers, Arlon, PTFE, ceramics, and Alu/Copper base materials.
Strict Quality Standards: Manufactured to UL and IPC standards using state-of-the-art laser drills and LDI.
Fast Turnaround Service: PCB build time as fast as 2-3 days with 12-hour express options for urgent projects.
Full Turnkey Assembly: Provides complete PCBA services including fabrication, sourcing, assembly, and testing.
Large Size Capacity: Can handle board sizes up to 1900mm*600mm with thickness up to 8.0mm.