Advanced Via Technology: Supports blind/buried vias, HDI build-up, and via-in-pad with filled vias.
Heavy Copper Capability: Heavy-copper up to 12oz with board thickness up to 6.5mm.
Wide Material Selection: Processes FR4, Rogers, Isola, Arlon, ceramics, and Alu/Copper base materials.
High Precision Specs: Min line spacing 0.075mm, min hole size 0.1mm, copper thickness 18um-3500um.
Comprehensive PCBA Service: Full turnkey assembly including fabrication, procurement, and assembly.
Fast Delivery Options: PCB build as fast as 2-3 days with 12-hour express service for urgent projects.
Strict Quality Standards: Manufactured to UL and IPC standards with 100% E-testing.