Advanced HDI Technology: Features blind/buried vias, sequential lamination, and solid copper filled vias.
Heavy Copper Capability: Accommodates heavy copper up to 12oz and board thickness up to 6.5mm.
Comprehensive Certifications: Certified with UL, ISO9001, ISO14001, RoHS, and IATF 16949 standards.
Wide Material Selection: Offers FR-4, Rogers, Taconic, Aluminum, and other specialized materials.
Full Assembly Services: Provides SMT, DIP, BGA assembly, and testing including AOI and ICT.
Customized PCB Shapes: Available in rectangular, round, slots, cutouts, and complex custom shapes.
Diverse Surface Finishes: Includes HASL, Immersion Gold, OSP, and Gold Plating options.