Advanced Via Technology: Features blind/buried vias, HDI micro via, and via-in-pad with solid copper filling.
Heavy Copper Capability: Supports heavy-copper up to 12oz and board thickness up to 6.5mm.
Large Board Dimensions: Maximum board size reaches 1010x610mm for diverse application needs.
Strict Quality Standards: Manufactured to the strictest UL and IPC standards using state-of-the-art equipment.
Fast Delivery Time: Standard delivery ranges from 24 hours to 5 days depending on order specifics.
Low MOQ Requirement: Minimum Order Quantity is only 1 PCS, suitable for prototyping and small batches.
Comprehensive Certifications: Products certified with RoHS, UL, CE, GS, and ISO standards.