Advanced HDI Technology: Features blind/buried vias, sequential lamination, and micro via technology with solid copper filled vias.
Heavy Copper Capability: Capable of manufacturing heavy-copper boards up to 12oz thickness.
Wide Material Selection: Processes FR4, high frequency PTFE, Rogers, Arlon, ceramics, Alu/Copper base, PI, and BT materials.
One-Stop PCBA Service: Provides full turnkey assembly including fabrication, component procurement, and assembly.
Fast Delivery Options: PCB build time as fast as 2-3 days with express 12-hour and 24-hour services available.
Strict Quality Standards: Manufactured to strict UL and IPC standards using state-of-the-art laser drills and LDIs.
Comprehensive Testing: Includes 100% E-Testing to ensure board reliability and functionality.