Advanced HDI Technology: Features blind/buried vias, sequential lamination, and solid copper filled vias.
Heavy Copper Capability: Supports heavy-copper up to 12oz with board thickness up to 6.5mm.
Wide Material Selection: Processes FR4, Rogers, Isola, Arlon, ceramics, PI, BT, and Alu/Copper base.
High Precision Specs: Min hole size 0.1mm, min line width 0.075mm, and line spacing 0.075mm.
Comprehensive PCBA Service: Full turnkey assembly including fabrication, component procurement, and assembly.
Strict Quality Standards: Manufactured to UL and IPC standards with 100% E-Testing.
Fast Delivery Options: PCB build time as fast as 2-3 days with 12-hour express service available.