Advanced HDI Technology: Features blind/buried vias, sequential lamination, and micro via build-up.
Heavy Copper Capability: Accommodates heavy copper up to 12oz and board thickness up to 6.5mm.
Wide Material Selection: Offers FR-4, Rogers, Taconic, Aluminum, and other specialized materials.
Full Turnkey Assembly: Provides SMT, DIP, BGA, and complete PCBA design and engineering support.
Strict Quality Testing: Includes AOI, ICT, FCT, and X-ray testing to ensure near 0% scrap rate.
Global Certifications: Certified with UL, ISO9001, ISO14001, IATF16949, and RoHS standards.
Rapid Quotation: Delivers quotes within 2 working days upon receiving complete documentation.