3D Molded Interconnect Device (MID) PCB Laser Direct Structuring on LCP Mechatronic Housing with Integrated Traces

Name: 3D Molded Interconnect Device (MID) PCB Laser Direct Structuring on LCP Mechatronic Housing with Integrated Traces
Brand: Fastline Circuits Co., Limited
SKU: 890075025

Guangdong, ChinaFastline Circuits Co., Limited

US$0.65-3.15

1 Piece

Sample price:US$1.30/piece.Request sample

Product profile

Customization

Available

Type

Lithium Battery

Charger Type

Solar Charger

Model NO.

BV-Q0129

Charger Application

Tablet, Laptop, Video Game Player, MP3/MP4 Player, Camera, Standard Battery

Nominal Voltage

12V

Charger Style

Solar Charger

Compatible Battery Type

12-Volt

Size

AAA

Certification

SASO, GOST-R, KC, PSE, RoHS, TUV, CB, CE

Socket Type

For E.U.

Recyclable

PCB Layer

1-26 Layers

SMT Line Quantity: 

Solder Mask

Any

Silk Screen

Any

Surface Treatment

HASL

PCB Assembly Type

SMT and DIP

PCB Service

One Stop Service

Small Orders

1 PCS Is Ok

Copper Thickness

1oz

Board Thickness

1.6mm

Board Dimensions: Smallest Size

50*50mm

BGA-Min Pitch

0.25mm

Testing Procedures

Visual Inspection ; X-ray Inspection ;Aoi (Automat

Board Shape

Rectangular ; Round ;Slots and Cut Outs; Complex a

Lead Time

12-20 Days

Transport Package

Vacuum+Carton Packing

Specification

RoHS, ISO9001, UL, SGS

Trademark

Fastline

Origin

Shenzhen, China

HS Code

8534009000

Production Capacity

20000 Square Meter/Mon

Company profile

Fastline Circuits Co., Limited

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2004-10-04 CertifiedNearest Port: Shenzhen Port, Hong Kong Port, Guangzhou PortAverage Response Time: ≤4.06h CertifiedTerms of Payment: LC, T/T, D/P, etc. CertifiedInternational Commercial Terms(Incoterms): FOB, CIF, DDP, FCA, EXW