Blind & Buried Via HDI PCB Micro Vias Down to 0.1mm High-Density Interconnect for Smartphones & IoT Modules

Name: Blind & Buried Via HDI PCB Micro Vias Down to 0.1mm High-Density Interconnect for Smartphones & IoT Modules
Brand: Fastline Circuits Co., Limited
SKU: 1985526141

Guangdong, ChinaFastline Circuits Co., Limited

US$0.23

1-499 Pieces

US$0.13

500-999 Pieces

US$0.10

1,000-4,999 Pieces

US$0.05

5,000+ Pieces

Product profile

Customization

Available

Metal Coating

Copper

Mode of Production

SMT

Model NO.

pcb

Layers

Multilayer

Base Material

FR-4

Certification

RoHS

Customized

Condition

Used

PCB Layer

1-26 Layers

Solder Mask

Green

Silk Screen

White

Surface Treatment

HASL

PCB Assembly Type

SMT and DIP

PCB Service

One Stop Service

Small Orders

Accepted

Copper Thickness

1oz

Board Thickness

1.6mm

Lead Time

12-20 Days

Transport Package

Vacuum+Carton Packing

Specification

RoHS, ISO9001, UL, SGS

Trademark

Fastline

Origin

Shenzhen, China

HS Code

8534009000

Production Capacity

20000 Square Meter/Mon

Key features

Customized PCB Layers: Supports 1 to 26 layers with full customization options.

HDI Micro Vias Capability: Enables blind and buried vias down to 0.1mm for high-density interconnects.

Comprehensive Certifications: ISO9001, UL, RoHS, and ISO14000 certified for global compliance.

One-Stop PCB Solution: Offers complete PCB manufacturing and assembly services including SMT and DIP.

Fast Prototype Delivery: PCB prototypes delivered in 1-6 days depending on layer count.

Small Order Acceptance: Accepts orders as low as 1 piece or panel for prototyping.

Global Export Experience: Serves customers in over 40 countries with 70% exports to US and Europe.

Company profile

Fastline Circuits Co., Limited

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2004-10-04 CertifiedNearest Port: Shenzhen Port, Hong Kong Port, Guangzhou PortAverage Response Time: ≤3.56h CertifiedTerms of Payment: LC, T/T, D/P, etc. CertifiedInternational Commercial Terms(Incoterms): FOB, CIF, DDP, FCA, EXW

About Our Factory & Business Background

Address3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China

Plant Area580 square meters

Registered Capital1,000,000 RMB

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsPrint Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, PCB Board, LED PCB, Circuit Board, PCB

R&D Engineers2 people

Our Industry Experience & Global Business Record

Year of Establishment2006-09-21

Main MarketsNorth America, South America, Europe, Southeast Asia/ Mideast

Number of Foreign Trading Staff8

Overseas Agent/BranchNo

Product Q&A

Q:Do you have an order minimum?

We accept order with as low as as quantity of 1(piece or panel).

Q:What kind of transportation we adopt?

It'll depend on your choice. And we often mail by DHL if you don't have special requirements. It is very fast and safe.

Q:How long can we received the product?

For mass production they will be shipped in 10~15 days. PCB, we can deliver in 5~7 days for the sample, after all Gerber data were clarified by our engineers. PCBA, 5~7 days after we complete the PCB parts.

Q:What is the lead time for PCB prototypes?

Lead time ranges from 1 day for 1-2 layers to 6 days for 22-26 layers, based on complete and problem-free data.

Q:Do you offer OEM and ODM services?

Yes, we provide OEM and ODM services for consumer electronics, automotive, and medical applications.