Customization
AvailableStructure
Multilayer FPCMaterial
Fiberglass Epoxy, Polyester FilmModel NO.
FpcbCombination Mode
Adhesive Flexible PlateApplication
Aviation and Aerospace, Consumer ElectronicsConductive Adhesive
Conductive Silver PasteFlame Retardant Properties
V2, V0Processing Technology
Delay Pressure Foil, Electrolytic FoilBase Material
CopperInsulation Materials
Epoxy ResinType
Rigid Circuit BoardMechanical Rigid
RigidDielectric
Fr4 and Polyimide, Fr-4Board Material
Fr4 and PolyimideBoard Layer
2 Layer Rigide and 2 Layer FlexCopper Thickness
1 OzMin. Line Space
0.05mm (2mil)Min Conductor Width
0.05mm(2mil)Min.Hole Size
0.075mm (3mil)Solder Mask
Any ColorSilkscreen
Any ColorSurface Finishing
Enig, Immersion Tin, Immersion Gold. OSPLead Time
5-6 Working DaysPCB Design
Customer ProvidedBoard Thickness
0.1mmMin Pad
+/-0.1mm (4mil)Outline Machining Accuracy
+/-0.1mm (4mil)MOQ
1 PCSTransport Package
Vacuum+Carton PackingSpecification
RoHS, ISO9001, UL, SGSTrademark
FLOrigin
Shenzhen, ChinaHS Code
8534009000Production Capacity
20000 Square Meter/Mon