OSP Aging Kinetics Model-Based Shelf Life Control PCB Using Accelerated Humidity Testing and Arrhenius-Predicted Solderability Window

Name: OSP Aging Kinetics Model-Based Shelf Life Control PCB Using Accelerated Humidity Testing and Arrhenius-Predicted Solderability Window
Brand: Fastline Circuits Co., Limited
SKU: 885259215

Guangdong, ChinaFastline Circuits Co., Limited

US$0.37

1-999 Pieces

US$0.32

1,000-4,999 Pieces

US$0.23

5,000+ Pieces

Sample price:US$0.12/piece.Request sample

Product profile

Customization

Available

Structure

Double-Sided FPC

Material

Polyimide

Model NO.

BV-Q0125

Combination Mode

Adhesive Flexible Plate

Application

Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace

Conductive Adhesive

Conductive Silver Paste

Flame Retardant Properties

Processing Technology

Electrolytic Foil

Base Material

Polyimide

Insulation Materials

Epoxy Resin

Board Material

Polyimide

Board Layer

Board Thickness

0.1 mm

Copper Thickness

1 Oz

Solser Mask

Yellow

Silkscreen

White

Surface Finishing

Enig

Lead Time

4-5 Working Days

Shipping Type

DHL.TNT, EMS, FedEx, UPS etc

PCB Design

Custom Design Product

Transport Package

Vacuum +Carton Packing

Specification

RoHS, ISO9001, UL, SGS

Trademark

Origin

Shenzhen, China

HS Code

8534009000

Production Capacity

20000square Meter/Mon

Company profile

Fastline Circuits Co., Limited

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2004-10-04 CertifiedNearest Port: Shenzhen Port, Hong Kong Port, Guangzhou PortAverage Response Time: ≤3.42h CertifiedTerms of Payment: LC, T/T, D/P, etc. CertifiedInternational Commercial Terms(Incoterms): FOB, CIF, DDP, FCA, EXW