OSP Film Uniformity Verified by Infrared Thermal Imaging PCBA Detecting Coating Thickness Variance Via Differential Heat Dissipation Patterns

Name: OSP Film Uniformity Verified by Infrared Thermal Imaging PCBA Detecting Coating Thickness Variance Via Differential Heat Dissipation Patterns
Brand: Fastline Circuits Co., Limited
SKU: 887902865

Guangdong, ChinaFastline Circuits Co., Limited

US$15.69

1-4,999 Pieces

US$3.69

5,000+ Pieces

Sample price:US$1.20/piece.Request sample

Product profile

Customization

Available

Metal Coating

Copper

Mode of Production

SMT

Model NO.

BV-Q0323

Layers

Multilayer

Base Material

Fr4

Certification

RoHS, CCC, ISO

Customized

Condition

New

Board Thickness

0.5mm-3mm

Copper Thickness

0.5oz-8oz

Material Type

Fr4

Surface Treatment

Enig

Solder Mask

Green/White/Blue/ Black/ Red

Silk Screen Color

White / Black

Board Layer

1-50 Layers

Shipping Type

DHL, UPS, TNT, EMS, FedEx etc

Packing Type

Carton + Vacuum

Lead Time

5-7 Days

Supply

Fast

Service

One-Stop

Min Hole

0.1mm

Min Trace

3/3mil

MOQ

1 PCS

Transport Package

Vacuum+Carton Packing

Specification

RoHS, ISO9001, UL, SGS

Trademark

Fastline

Origin

Shenzhen, China

HS Code

8534009000

Production Capacity

20000 Square Meter/Mon

Company profile

Fastline Circuits Co., Limited

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2004-10-04 CertifiedNearest Port: Shenzhen Port, Hong Kong Port, Guangzhou PortAverage Response Time: ≤3.40h CertifiedTerms of Payment: LC, T/T, D/P, etc. CertifiedInternational Commercial Terms(Incoterms): FOB, CIF, DDP, FCA, EXW