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PCB with Chip-on-Board (COB) Bonding Direct Die Attach & Gold Wire Bonding Low Profile for LED & Sensor Modules
US$0.86-3.56
1 Piece
Product profile
Customization
AvailableInsulation Materials
Organic ResinFlame Retardant Properties
HBModel NO.
FL125Application
AerospaceBoard Material
Fr4 and PolyimideBoard Layer
2 Layer Rigide and 2 Layer FlexCopper Thickness
2 OzMin. Line Space
0.1mmMin.Hole Size
0.15mmSolder Mask
Any ColorSilkscreen
Any ColorSurface Finishing
Gold PlateLead Time
5-6 Working DaysPCB Design
Custom Design ProductDielectric
Fr4 and PolyimideTransport Package
Vacuum+Carton PackingSpecification
RoHS, ISO9001, UL, SGSTrademark
FLOrigin
Shenzhen, ChinaHS Code
8534009000Production Capacity
20000 Square Meter/MonCompany profile
Business Type: Manufacturer/FactoryExport Year: 2004-10-04 CertifiedNearest Port: Shenzhen Port, Hong Kong Port, Guangzhou PortAverage Response Time: ≤3.16h CertifiedTerms of Payment: LC, T/T, D/P, etc. CertifiedInternational Commercial Terms(Incoterms): FOB, CIF, DDP, FCA, EXW
About Our Factory & Business Background
Address3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area580 square meters
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsPrint Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, PCB Board, LED PCB, Circuit Board, PCB
R&D Engineers2 people
Our Industry Experience & Global Business Record
Year of Establishment2006-09-21
Main MarketsNorth America, South America, Europe, Southeast Asia/ Mideast
Number of Foreign Trading Staff8
Overseas Agent/BranchNo
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*To:Fastline Circuits Co., Limited
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