Robust Pad Design and Thermal Profile Management for Durable Industrial Connections Medical Device PCB Printed Circuit Board Assembly PCBA

Name: Robust Pad Design and Thermal Profile Management for Durable Industrial Connections Medical Device PCB Printed Circuit Board Assembly PCBA
Brand: Fastline Circuits Co., Limited
SKU: 886311285

Guangdong, ChinaFastline Circuits Co., Limited

US$0.57

1-999 Pieces

US$0.46

1,000-1,999 Pieces

US$0.43

2,000-9,999 Pieces

US$0.37

10,000+ Pieces

Sample price:US$0.20/piece.Request sample

Product profile

Customization

Available

Metal Coating

Copper

Mode of Production

SMT

Model NO.

FL53

Layers

Multilayer

Base Material

FR-4

Certification

RoHS, CCC, ISO, UL

Regular Board Thickness

1.6mm

Board Material

Fr4, Bt HDI Material

Board Layer

4 Layers

Surface Finihsing

HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP

Copper Thickness

1 Oz

Thickness of Copper Foil Wire

8-240 Um(4oz)

Min. Hole Size

0.075mm(3mil)

Min Pad

+/- 0.1mm (4mil)

Min Board Thickness

0.1mm Only for Single and Double Sided

Min. Line Width/Space

0.05mm (2mil)

Outline Machining Accuracy

+/- 0.1mm (4mil)

Lead Time

6-8 Working Days

Silksreen

Any You Like

Solder Mask

Any You Like

MOQ

1PCS

Transport Package

Vacuum+Carton Packing

Specification

RoHS, ISO9001, UL, SGS

Trademark

Origin

Shenzhen, China

HS Code

8534009000

Production Capacity

20000 Square Meter/Mon

Company profile

Fastline Circuits Co., Limited

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2004-10-04 CertifiedNearest Port: Shenzhen Port, Hong Kong Port, Guangzhou PortAverage Response Time: ≤3.03h CertifiedTerms of Payment: LC, T/T, D/P, etc. CertifiedInternational Commercial Terms(Incoterms): FOB, CIF, DDP, FCA, EXW