What are the available bead sizes?

Bead sizes include 0.5-2mm, 1-3mm, 2-4mm, 1.7-2.5mm, and 3.0-5.0mm.

What is the lead time for orders?

The average lead time is within 15 workdays for both peak and off-season periods.

Pillowpak 1g Molecular Sieve Low Dust Desiccant Packet for Semiconductors

Name: Pillowpak 1g Molecular Sieve Low Dust Desiccant Packet for Semiconductors
Brand: Foshan Nicepak Packaging Materials Co., Ltd.
SKU: 2230384515

Guangdong, ChinaFoshan Nicepak Packaging Materials Co., Ltd.

US$0.0048

100,000-999,999 Pieces

US$0.0131

1,000,000-9,999,999 Pieces

US$0.012

10,000,000+ Pieces

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

CAS No.

12173-28-3

Formula

2/3K2o.1/3na2o.Al2O3.2sio2.9/2H2O

Model NO.

MS-1g

EINECS

215-684-8

Shape

Beads

Drying Method

Static Drying

Kind

Silica-Gel Desiccant

Sorbent

Molecular Sieves

Desiccant

Physical Desiccant

Moisture Absorption Capacity

28%-33%

Bead Size

0.5-2, 1-3 or 2-4(mm)

Color

Beige

Packet Dimension

20*40(mm) or 16*42(mm)

Applications

Rapid Test Kits, Food and Pharma, etc

Packing

Vacuum

Packet Material

Non-Woven or OPP or Tyvek

MOQ

100000PCS

Certificates

FDA, MSDS, DMF, RoHS

Transport Package

Cartons and Pallets

Specification

0.5g, 1g, 2g, 5g, 10g, etc

Trademark

Customized

Origin

China

HS Code

2839900090

Production Capacity

1million PCS/Day

Key features

Tyvek Substrate Material: Extremely strong, hard to tear, non-dusting with superior print quality.

High Moisture Absorption: Absorbs 28%-33% of its weight in moisture at specific humidity levels.

Food Contact Compliant: Meets DIN55473 standards for direct food contact applications.

Military Grade Standard: Meets Mil Spec 3464 Type I & II for government and military use.

Low Dust Desiccant: Ideal for semiconductors and sensitive electronics to prevent contamination.

Certified Safety: Holds FDA, MSDS, DMF, and RoHS certificates for global compliance.

Customizable Sizes: Available in various packet dimensions from 0.5g to 1000g capacities.

Versatile Applications: Suitable for rapid test kits, food, pharma, and industrial gas drying.

Company profile

Importers and Exporters

Foshan Nicepak Packaging Materials Co., Ltd.

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2010-10-01Nearest Port: ShenzhenAverage Response Time: ≤3.30hTerms of Payment: T/T, D/P, Western UnionInternational Commercial Terms(Incoterms): EXW, CFR, CIF, DDP, DAP

AI-Powered supplier vetting

SummaryThe supplier is a China-based limited company identified as both a trading company and manufacturer/factory, offering packaging materials, packaging equipment, desiccants, barrier bags, and related moisture-control products. It holds a valid import/export license and reports that 90% of total sales are exports, with overseas agents or branches available. Customization is supported from samples, designs, and through several customization levels. However, the supplier has only three employees, reports no cooperative suppliers in one record while separately naming five qualified service suppliers, and lacks written procedures or records for supplier-service assessment, corrective actions, and complaint handling. No new products were launched in the past year, and no ODM, SDK, overseas warehouse, overseas showroom, or offline trade-show capability was reported. Financial-year data is present for 2021–2023, but no assessable financial results are provided.

CertificationsThe supplier explicitly reports a valid import/export license, and an audit by BV is recorded with a report start date of November 7, 2024. The available slices do not identify product, quality, or management-system certifications, so certification coverage cannot be fully assessed.

After-Sales capabilityThe supplier reports five qualified service suppliers and overseas agents or branches, but it has no written procedures or records for service-capability assessment, corrective and preventive actions, or customer-complaint handling. It also lacks overseas warehouses and showrooms, limiting documented service infrastructure.

R&D capabilityThe supplier launched no new products in the past year, provides no ODM service, and has no available SDK. These are explicit limitations in product-development and technical-support capability, although OEM service for well-known brands is reported.

Customization capabilityThe supplier explicitly supports customization from samples, full customization, minor customization, flexible customization, and customization from designs. This indicates broad stated customization coverage, although no production examples, technical process details, or delivery performance evidence is provided.