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IC Wafer Double Side Lapping Machine for Uniform Thickness
US$7,000.00
2 Pieces
US$6,500.00
3+ Pieces
Product profile
Customization
AvailableWarranty
1-Year WarrantyType
Double Side Lapping MachineModel NO.
BWVoltage
380 VCNC or Not
CNCCore Components
PLCMachinery Test Report
ProvidedVideo Outgoing-Inspection
ProvidedPower (Kw)
5.5Weight (Kg)
1800Machining Accuracy
High PrecisionApplicable Industries
Grinding IndustryInstallation Method
Floor-StandingGrinding Wheel Speed
3000(Rpm)Specification
1700*1300*2170(mm)Trademark
BWOrigin
Jiangsu, ChinaKey features
Integrated Grinding Process: Thinning machine achieves integrated rough grinding and fine grinding for complete silicon wafer production lines.
High Precision Control: Adopts PLC, grating ruler, and servo control for fully closed-loop thickness control with high processing precision.
Stable Operation: Equipment designed for stable operation with high processing precision suitable for the grinding industry.
Dual Position Switching: Lower spindle carries product and switches between rough grinding and fine grinding positions automatically.
1-Year Warranty: Comprehensive 1-year warranty coverage provided for the machine.
Machinery Test Report: Provided to verify machine performance and quality before shipment.
Video Inspection Available: Video outgoing-inspection provided to ensure product quality prior to delivery.
High Speed Grinding: Grinding wheel speed reaches 3000 Rpm for efficient material processing.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 2 Years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤2.60h
AI-Powered supplier vetting
SummaryNanjing New Donor Machinery Equipment Co., Ltd. is identified as a China-based manufacturer/factory producing heat exchangers, fin tubes, and fin tube machines. The supplier reports OEM service for well-known brands, broad customization options, export activity, quality-management practices, and experienced technical and production teams. Its export sales share is stated as 71%–90%, but it began exporting only two years ago. Evidence is insufficient to confirm certifications, after-sales capability, financial strength, or customer cases. The supplier reports no available SDK, has four employees, and its raw-material traceability, environmental assessment, and fire-drill status are unknown. An audit by BV is documented with a validity period from June 25, 2025 to June 24, 2026, but the provided audit result value is not interpretable as a performance conclusion.
Supplier typeThe supplier is explicitly identified as a Manufacturer/Factory and a limited company in China, operating in manufacturing and processing machinery. Its stated products are heat exchangers, fin tubes, and fin tube machines.
R&D capabilityThe supplier states that it continuously develops safer, lighter, and more energy-saving products, pursues technological innovation, and conducts mechanical-equipment R&D. However, it reports no available SDK, and no measurable innovation output or R&D performance is provided.
Production capacityThe supplier is identified as a factory with a stated scientific management system, high-standard quality control, advanced production equipment, sophisticated testing equipment, and experienced technical and production teams. Its product scope covers heat exchangers, fin tubes, and fin tube machines, although the reported employee count is four.
Customization capabilityThe supplier explicitly supports customization from samples, designs, full customization, minor customization, and flexible customization. This provides direct evidence of broad customization coverage.
Product Q&A
Q:What is the warranty period for this machine?
A:
We provide a 1-year warranty for the IC Wafer Double Side Lapping Machine.
Q:Does the machine support integrated grinding processes?
A:
Yes, the thinning machine can achieve integrated rough grinding and fine grinding to build a complete silicon wafer production line.
Q:What control system does the machine use?
A:
It adopts a PLC, grating ruler, and servo control to form a fully closed-loop control system for precise product thickness control.
Q:Is a machinery test report provided?
A:
Yes, a machinery test report is provided to verify the machine's performance.
Q:What is the lead time for this machine?
A:
The lead time is 1-3 months during the off-season and 3-6 months during the peak season.
Send Inquiry
*To:
Nanjing New Donor Machinery Equipment Co., Ltd.
Nanjing New Donor Machinery Equipment Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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