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China High Frequency Automatic Canon Fpa-3000 I4 Semiconductor Wafer Die Lithography Machine
US$455,500.00-1,554,000.00
1 set

Product profile

Customization

Available

After-sales Service

24 Hrs Online

Function

Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold

Model NO.

FPA-3000 I4

Demoulding

Automatic

Condition

Used

Certification

CCC, PSE, FDA, RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

>1,000,000 Shots

Delivery

1-7 Days

MOQ

1 PC

Quality

100% Tested

Adaptation

Canon Lithography Machine

Inventory

Availability

Transport Package

Carton Box and Plastic Bag

Specification

9800*7000*4950

Trademark

Canon

Origin

Japan

HS Code

8479909090

Production Capacity

500PCS/Year

Key features

Utilizing a 365 nm i line light source paired with a high performance optical system featuring a numerical aperture of 0.45 , it achieves a resolution of 0.35 UM, meeting the manufacturing
Capable of handling 4-inch to 8-inch wafers and supporting SEMI and JEIDA standards as well as notched or flat wafers, it adapts to a wide range of production line requirements.
Alignment accuracy is better than 0.06 um ; throughput is approximately 59 wafers per hour for 8 inch wafers and up to 83 wafers per hour for 6 inch wafers

Company profile

Guangdong Xinling Industrial Co., Ltd
In-stock CapacityOEM ServicesOverseas ServicesSelf-branded
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤5.46h

About Our Factory & Business Background

AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5

Our Production Capability & Technical Expertise

Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes

Our Industry Experience & Global Business Record

Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:1. What products can you provide?
A:
We can provide lithography machines, etching machines, coating and developing systems or uniform coating and developing systems, thin film deposition equipment, ion implantation machines, oxidation/diffusion/annealing equipment, also known as heat treatment equipment
Q:2. The functions of the lithography machine
A:
Pattern transfer: Just like a projector, the circuit patterns on the mask are projected onto the surface of a silicon wafer coated with photoresist through light. Microfabrication: Using ultraviolet light or extreme ultraviolet light, the photoresist undergoes a chemical reaction, and after development, fine nano-scale lines are etched onto the wafer.
Q:3. The principle of the lithography machine
A:
The lithography machine utilizes the principle of optical projection to shrink the circuit patterns and expose them onto the silicon wafer coated with photoresist. It is the core equipment in chip manufacturing. Its essence is to achieve precise transfer of nanoscale graphics through the use of light sources, masks, and precise optical systems.
Q:4. The application scope of the lithography machine
A:
Display and Sensing: Electrode fabrication for flat panel displays (LCD/OLED), touchscreen sensors, and MEMS micro-electromechanical systems.
Q:5. What are the technical challenges of a lithography machine?
A:
The precision of the lithography machine is limited by the wavelength of the light source and the numerical aperture of the optical system. Furthermore, the EUV light source needs to generate plasma through laser bombardment of tin droplets, which is an extremely difficult technical challenge.

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