High Accuracy China Wafer Semicondcutor Automatic Ke Dd7460 Supplier Horizontal Thermal Processing Equipment

We can provide Gelatinize machines, etching machines, coating and developing systems or uniform coating and developing systems, thin film deposition equipment, ion implantation machines, oxidation/diffusion/annealing equipment, also known as heat treatment equipment

Designed for precision heat treatment processes, it supports annealing, diffusion, oxidation, sintering, and more. Compatible with 3- to 12-inch wafers, it can process both semiconductor wafers and metal materials. It features microprocessor-based programming for the automated execution of multi-step processes.

A uniform temperature field is established within the chamber through the coordinated temperature control of multi-zone heating elements and water cooled walls. A PID controller and solid-state relays regulate heating power in real time to heat the chamber to 1700, enabling physical or chemical reactions of the wafer at the set temperature.

This equipment is primarily used for processes such as diffusion, oxidation, and annealing of semiconductor wafers. It is also suitable for various heat treatment applications, including annealing, brazing, quenching, tempering, and sintering. With a wide temperature range of up to 1700 1800 and a large 60L chamber, it meets high precision heat treatment requirements across sectors ranging from laboratory RD to industries such as automotive, aerospace, medical, and electronics.

The core challenge lies in achieving exceptional temperature uniformity and precise process control. To eliminate thermal gradients within the chamber, the equipment employs designs such as water-cooled walls and multi-zone heating elements, placing rigorous demands on the coordinated control of heating and cooling systems. Simultaneously, the equipment must balance rapid heating capabilities with thermal stability to meet diverse process requirements such as annealing and diffusion for various