High-Precision DNS La 820 China Used Semiconductor Thermal Processing Equipment

We can provide Gelatinize machines, etching machines, coating and developing systems or uniform coating and developing systems, thin film deposition equipment, ion implantation machines,oxidation/diffusion/annealing equipment, also known as heat treatment equipment

The equipment adopts a vertical furnace tube structure, and uses multi-zone independent heating elements and adaptive real-time temperature control (ART Control) algorithms to work together to accurately control the cavity temperature field. It is also equipped with a forced cooling unit to achieve rapid heating and cooling and uniform heat treatment.

Designed for multi-step thermal processing of wafers, including oxidation (dry/wet), diffusion, annealing, and LPCVD. It supports batch processing handling up to 150 wafers per run and features an advanced control system for fully automated operation and process recipe management.

Widely used for wafer heat treatment in fields such as semiconductor integrated circuits, power devices, MEMS, and display panels. It is compatible with 4 to 8 inch (100 200 mm) silicon wafers and is suitable for the manufacturing processes of devices including logic chips, memory chips, and compound semiconductors.

The core challenge lies in achieving wafer-level temperature uniformity typically requiring a variance of within 1 to ensure device yield. At the same time, it is necessary to address the stringent low thermal budget requirements of advanced process nodes, the durability of high temperature components, high equipment costs and long RD cycles, as well as compatibility issues associated with upgrading processes from 200mm to 300mm.