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Semiconductor Wafer Cutting Machine Versatile Disco Dfd681 Wafer Dicing Saw Machine
US$160,000.00-620,000.00
1 Set

Product profile

Customization

Available

After-sales Service

24h Online

Function

High Temperature Resistance

Model NO.

DFD681

Demoulding

Automatic

Condition

Used

Certification

CCC, PSE, FDA, RoHS, ISO, CE

Warranty

3 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Delivery

1-7 Days

MOQ

1 Set

Quality

100% Tested

Adaptation

Wafer Dicing Saw Cutting Machine

Inventory

Available

Transport Package

Plastic Bag&Carton Box

Specification

2000 KG

Trademark

disco

Origin

USA

HS Code

8479896200

Production Capacity

500PCS/Year

Key features

Maglev spindle achieves nanometer-level cutting precision.
Spindle speed ranges from 20,000 to 80,000 RPM.
Integrated blade set enables rough to fine cutting.
Multi-spectral sensors enable ultra-dense positioning.
Image capture frequency reaches up to 500Hz.

Company profile

Guangdong Xinling Industrial Co., Ltd
In-stock CapacityOEM ServicesOverseas ServicesSelf-branded
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.51h

About Our Factory & Business Background

AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5

Our Production Capability & Technical Expertise

Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes

Our Industry Experience & Global Business Record

Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What is the DISCO DFD681?
A:
A nanometer-level dicing saw.
Q:What is the minimum order quantity (MOQ)?
A:
The MOQ is 1 set.
Q:How long does delivery take?
A:
Delivery takes about 1 to 7 working days.
Q:Is sample availability supported?
A:
Yes, samples are available.
Q:What after-sales service is provided?
A:
We provide 24-hour online support with quick response times.

Send Inquiry

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