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High Sensitivity Mems Vision Sensor Chip Assembly for Precise Applications

Name: High Sensitivity Mems Vision Sensor Chip Assembly for Precise Applications
Brand: Kunshan Golden Light Electronic Technology Co., Ltd.
SKU: 2330416545

Jiangsu, ChinaKunshan Golden Light Electronic Technology Co., Ltd.

US$0.18-0.24

2,000 Pieces

Sample price:US$1.00/piece.Request sample

Product profile

Customization

Available

After-sales Service

1year

Warranty

1year

Model NO.

GLE-MVSCA01

Production Process

Semiconductor Packaging

Output

Digital Signal

Brand

Gle

Material

Polymer

Product Name

Stable Mems Micro Display Sensor Gle Mems001

Size

Customized

Shape

Customized

Process

Semiconductor Packaging and Wire Bonding

Certification

IATF 16949

MOQ

1000PCS

Lead Time

7-35 Days

QC

100 % Inspection Before Shipping

Service

OEM & ODM

Usage

Optical Imaging and Industrial Vision

Transport Package

Carton

Specification

customized

Trademark

GLE

Origin

China

HS Code

3926909090

Production Capacity

30000PCS/Week

Key features

High sensitivity for accurate optical signal capture

Ceramic package structure provides stable performance under complex working condition

Exposed window design to meet optical signal transmission requirement

Company profile

Importers and ExportersStandardized quality controlManagement Certification

Kunshan Golden Light Electronic Technology Co., Ltd.

Jiangsu, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤8.23h

AI-Powered supplier vetting

SummaryKunshan Golden Light Electronic Technology Co., Ltd. is a China-based manufacturing factory established in 2010, with 185 employees and activities covering electronic components, plastic packaging, injection molding, and stamping molds. The supplier offers plastic housings, reed switches, magnetic sensors, motor housings, and current sensors. It demonstrates broad customization, 3D design, ODM, and OEM capabilities, and reports new products during the past year. Quality-related procedures are documented for approved suppliers, corrective and preventive actions, customer complaints, and finished-product inspection. However, the provided information shows no in-stock capacity, overseas warehouse, showroom, agents, branches, or offline trade-show participation. Financial credibility, formal certifications, production capacity details, and specific customer cases cannot be sufficiently verified from the available slices.

Supplier typeThe supplier is identified as a limited company and factory in Kunshan, Jiangsu, China, established in 2010. Its stated business includes production and sales of electronic components and the design and manufacture of plastic packaging, injection molding, and stamping molds.

After-Sales capabilityThe supplier has clear procedures and followed records for corrective and preventive actions and customer complaints, supporting an established service-response process. However, it reports no in-stock service capacity, overseas warehouse, overseas showroom, overseas agent or branch, and no overseas-service countries, indicating limited overseas service infrastructure.

R&D capabilityThe supplier provides 3D software design services, reports new products during the past year, and offers ODM services. It lacks an available SDK, but the documented design and new-product capabilities provide explicit evidence of innovation activity.

Production capacityThe supplier is a factory with 185 employees and stated manufacturing activities involving electronic components, plastic packaging, injection molding, and stamping molds. However, it reports no valid manufacturing-capacity contract with an associated subcontractor and no in-stock capacity; detailed output, equipment, and throughput data are not provided.

Customization capabilityThe supplier explicitly offers customization from samples, full customization, customization from designs, minor customization, and flexible customization, alongside 3D software design services. Its stated mold, injection-molding, packaging, and electronic-component activities are consistent with the reported customization scope.

Client casesThe supplier reports OEM service for well-known brands, which is direct evidence of experience serving branded customers. No customer names, project details, product volumes, or verifiable case references are supplied, so the breadth and quality of customer cases cannot be assessed.