Lightweight Thermal Core Panel for Enhanced Building Insulation Systems

The core difference lies in the molecular structure. PIR has been modified to form more stable isocyanurate rings, with a decomposition temperature of up to 260, which is significantly better than PUR (about 220). It produces less smoke when burning and achieves a more stable and reliable B1-level flame-retardant effect.

No. The PIR board has an extremely high closed-cell rate (>95%), and its thermal conductivity can be stably maintained at 0.024 W/(mK) for a long time. Even in ultra-low temperature environments, its foam structure remains stable, effectively blocking heat transfer and ensuring no decline in insulation performance.

Its long-term value is mainly reflected in three aspects: better fire safety reduces insurance and risk costs; lower long-term thermal conductivity brings significant energy-saving benefits; higher dimensional stability reduces maintenance needs, making the comprehensive cost throughout the life cycle more advantageous.

A dedicated eccentric hook lock or tongue and groove insertion system is adopted, combined with low-temperature elastic sealant. This design can maintain tight interlock when the sheet shrinks due to temperature differences, achieving dual physical and chemical sealing and effectively preventing cold bridges and cold leakage.