Near Field Communication Sticker Chip Sticker for RFID Payment (LAP-E)

Name: Near Field Communication Sticker Chip Sticker for RFID Payment (LAP-E)
Brand: Go Young Technology (Shanghai) Co., Ltd.
SKU: 672281332

Shanghai, ChinaGo Young Technology (Shanghai) Co., Ltd.

US$0.55-2.00

1,000 Pieces

Product profile

Customization

Available

Function

Identification, Payment, Information

Type

Label

Model NO.

LAP-E

Material

Paper

Read-Write Method

Non-Contact Type

Label Category

Passive

Structure

Read-Write Card

Application Field

Market

Power Supply Mode

Passive Card

Frequency

High Frequency

Data Transmission Mode

Parallel

Operating Frequency

13.56MHz

Operating Distance

1-100cm.

Dimension

50× 50 × T0.3mm

Operating Temperature

-20c ~ +55c

Transport Package

in Bulk

Specification

Rohs

Trademark

GYRFID

Origin

China

HS Code

85235210

Production Capacity

100.000/Year

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceExhibition ExperienceFast Delivery

Go Young Technology (Shanghai) Co., Ltd.

Shanghai, China

CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Full Customization CertifiedExport Year: 4 years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤24h

AI-Powered supplier vetting

SummaryGo Young Technology (Shanghai) Co., Ltd. is a trading company based in Shanghai, China, with a focus on electronic and technology products. Established in 2020, the company offers reasonable pricing and reliable quality, with a strong export focus, especially to Europe. They provide after-sales service and have quality assurance processes in place. However, they lack overseas warehouses and showrooms and have no available SDKs for R&D. Financial and production capabilities are not thoroughly documented, and the company has a small team of five employees.

Supplier typeGo Young Technology is a trading company from Shanghai, China, specializing in electronic and technology-related services.

After-Sales capabilityThe supplier offers after-sales warranty and repair services, particularly in Europe, and participates in trade shows.

R&D capabilityThe company lacks SDK availability, indicating limited R&D capabilities.

Production capacityThe company has a minimal production capacity with only one quality inspector and relies on packing staff for product checks.

Customization capabilityThe company offers full customization in design services.