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Fire Protection Two-Component Industrial Adhesive for Semiconductor Chip Soft Packaging Applications
US$6.00
1,000-4,999 kg
US$5.90
5,000-11,999 kg
US$5.70
12,000+ kg
Product specifications
Specification
Sample price:US$0.00/kg.Request sample
Product profile
Application
PackingBonding Function
Lamination AdhesiveColor
YellowModel NO.
HB180A/BComposition
Organic MaterialMorphology
SolventApplication Scope
General Dry LaminationApplication Concentration
30%Suggested Drying Temperature
50℃- 60℃ -70℃Curing Temperature
50℃ - 60℃Curing Time
More Than 72 HoursTransport Package
Standard Packaging or CustomizedSpecification
Standard Specifications or CustomizedTrademark
Peaceful StateOrigin
Hebei, ChinaCompany profile
CertifiedBusiness Type: Trading Company CertifiedCustomization Options: Customization from Samples CertifiedExport Year: 1 Year CertifiedNearest Port: Tianjin PortAverage Response Time: ≤1.33h CertifiedTerms of Payment: LC, T/T, PayPal, etc.
About Our Factory & Business Background
AddressRoom 415, 4th Floor, Building 1, Court 198, Changcui Road, Changping District, Beijing, China
Plant Area44 square meters
Number of Employees2
Registered Capital10,000,000 RMB
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 Ton
Supply Chain Partners10
Our Production Capability & Technical Expertise
Main ProductsAdhesives
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2015-10-10
Main MarketsEurope, Domestic
Repeat Buyers Choice80%~100%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Management System CertificationISO9001:2015, ISO14001
Cooperated with Fortune 500No
Send Inquiry
*To:
Beijing Hengtai Technology Development Co., Ltd.
Beijing Hengtai Technology Development Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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