Fire Resistant Solvent Based Adhesive for PCB Semiconductor Chip Soft Film Packaging

Name: Fire Resistant Solvent Based Adhesive for PCB Semiconductor Chip Soft Film Packaging
Brand: Beijing Hengtai Technology Development Co., Ltd.
SKU: 2315090525

Beijing, ChinaBeijing Hengtai Technology Development Co., Ltd.

US$6.00

1,000-4,999 kg

US$5.90

5,000-11,999 kg

US$5.70

12,000+ kg

Product specifications

Specification

Sample price:US$0.00/kg.Request sample

Product profile

Application

Packing

Bonding Function

Lamination Adhesive

Color

Yellow

Model NO.

HB180A/B

Composition

Organic Material

Morphology

Solvent

Application Scope

General Dry Lamination

Application Concentration

30%

Suggested Drying Temperature

50℃- 60℃ -70℃

Curing Temperature

50℃ - 60℃

Curing Time

More Than 72 Hours

Transport Package

Standard Packaging or Customized

Specification

Standard Specifications or Customized

Trademark

Peaceful State

Origin

Hebei, China

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceSelf-branded

Beijing Hengtai Technology Development Co., Ltd.

Beijing, China

CertifiedBusiness Type: Trading Company CertifiedCustomization Options: Customization from Samples CertifiedExport Year: 1 Year CertifiedNearest Port: Tianjin PortAverage Response Time: ≤0.13h CertifiedTerms of Payment: LC, T/T, PayPal, etc.

AI-Powered supplier vetting

SummaryThe supplier is a trading company with a focus on sales of chemical products, mechanical equipment, and plastic products. They possess ISO 9001 and ISO 14001 certifications, indicating a commitment to quality and environmental standards. Despite having a clear procedure for handling complaints and corrective actions, their financial performance shows no revenue or profit growth over recent years. Moreover, they have minimal innovation and production capabilities, lacking R&D outcomes, ODM services, and OEM for popular brands. Their customization is limited to samples, with no 3D design services available. The company has not participated in trade shows, and they do not have overseas operational capabilities.

CertificationsThe supplier holds ISO 9001 and ISO 14001 certifications, demonstrating compliance with quality and environmental management standards.

After-Sales capabilityThe supplier has established procedures for corrective actions and complaint handling, indicating a structured approach to after-sales service.

Financial creditThe supplier shows poor financial performance with no operating revenues or profit over the past years.

R&D capabilityThe supplier lacks innovation capability, with no new products launched and no R&D or ODM services.

Production capacityThe supplier has no in-stock service capacity or overseas production capabilities.

Customization capabilityCustomization is limited to samples, with no 3D design or ODM services offered.

Client casesThere is a high preference rate from repeat buyers, suggesting customer satisfaction with existing services.