3250 Epoxy Board, High Temperature and Corrosion Resistant Epoxy Resin Board

Name: 3250 Epoxy Board, High Temperature and Corrosion Resistant Epoxy Resin Board
Brand: Zhejiang Hengfeng Insulation Materials Co., Ltd.
SKU: 2210617995

Zhejiang, ChinaZhejiang Hengfeng Insulation Materials Co., Ltd.

US$10.48-10.82

100 kg

Sample price:US$0.10/kg.Request sample

Product profile

Customization

Available

Application

Electrical Power System, Electronic Device

Color

White

Model NO.

3250

Material

Sheet Molding Compound

Maximum Voltage

40kv

Thermal Rating

H 180

Thickness

3-40mm

Water Absorption

≤0.5%

Density

1.8-2.0

Dielectric Loss Factor

≤0.04

Horizontal Tensile Strength

≥300MPa

Vertical Tensile Strength

≥320MPa

Transport Package

Wooden Packing

Specification

1220*2440mm/1230*2040mm

Trademark

zjhengfeng

Origin

China

HS Code

8547909000

Production Capacity

50000PCS

Company profile

Zhejiang Hengfeng Insulation Materials Co., Ltd.

Zhejiang, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Ningbo Port, Shanghai PortAverage Response Time: ≤0.10h

AI-Powered supplier vetting

SummaryThe supplier focuses on manufacturing and sales of various electrical and insulation components. They have a strong emphasis on research and development, offering multiple customization options. However, their financial data and certification holding indicate potential weaknesses. They lack overseas service capabilities and have minimal after-sales service mechanisms. Despite offering OEM and ODM services, their innovation capability is limited by the absence of new products and SDK availability.

Supplier typeThe supplier is involved in manufacturing, processing, and sales of electrical and insulation components.

CertificationsThe supplier does not hold any certifications for their management systems.

Financial creditThe financial data shows no operating revenues or gross margin over recent years, indicating financial instability.

R&D capabilityThe supplier invests in R&D but has not released new products recently and lacks SDK availability.

Customization capabilityThe supplier offers extensive customization services, including full and minor customization options.