Hgtech Wafer Cutting Series Semiconductor Wafer Processing Plant Laser Modified Cutting Equipment

Name: Hgtech Wafer Cutting Series Semiconductor Wafer Processing Plant Laser Modified Cutting Equipment
Brand: Wuhan Huagong Laser Engineering Co., Ltd.
SKU: 2092089302

Hubei, ChinaWuhan Huagong Laser Engineering Co., Ltd.

US$18,800.00-59,800.00

1 Piece

Sample price:US$1.00/piece.Request sample

Product profile

Customization

Available

Application

Power Electronic Components, Semiconductor Wafer

Batch Number

2023+

Model NO.

Semiconductor Wafer

Certification

CCC, EPA

Manufacturing Technology

Optoelectronic Semiconductor

Material

Power Semiconductor

Model

PC817

Package

Semiconductor Wafer

Signal Processing

Digital

Type

Intrinsic Semiconductor

Transport Package

Packing

Specification

Custom

Trademark

HGTECH

Origin

China

Production Capacity

500PCS

Company profile

Wuhan Huagong Laser Engineering Co., Ltd.

Hubei, China

CertifiedBusiness Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2018-08-14 CertifiedNearest Port: Shanghai Port, Wuhan Port, Shenzhen PortAverage Response Time: ≤15h CertifiedTerms of Payment: LC, T/T, D/P, etc.

AI-Powered supplier vetting

SummaryWuhan Huagong Laser Engineering Co., Ltd. is identified as a Chinese manufacturer established in 1997, with 2,650 employees, a 50,000 m² manufacturing plant, seven production lines, and products centered on laser intelligent equipment. The supplier reports ISO9001:2015, ISO14001:2015, and OHSAS18001:2007 certifications, 200 R&D engineers, and 50 quality-control staff. It has self-operated import-export rights, exports to a broad range of markets, and reports lead times of within 15 working days off-season and one month during peak season. Evidence supports substantial manufacturing scale, quality-system certification, international exporting, and R&D resources. However, the provided information does not establish after-sales service arrangements, customization practices, detailed financial credibility, or specific customer project outcomes. A buyer association with Foxconn Hon Hai Technology India Mega Development is recorded, but the nature and performance of that relationship are not specified.

Supplier typeThe supplier is explicitly classified as a manufacturer and operates in industrial equipment and manufacturing machinery. Its stated main product is laser intelligent equipment, with listed products including laser cutting, marking, welding, and surface-treatment equipment.

CertificationsThe supplier reports ISO9001:2015, ISO14001:2015, and OHSAS18001:2007 certificates, covering quality management, environmental management, and occupational health and safety management. This is explicit evidence of multiple management-system certifications.

R&D capabilityThe supplier reports 200 years of total R&D engineer experience and presents itself as a provider of laser equipment and intelligent manufacturing solutions. Its product scope includes multiple laser-processing technologies, supporting an innovation-related capability assessment, although no patents, product-development results, or R&D investment details are provided.

Production capacityProduction scale is supported by 2,650 employees, a 50,000 m² manufacturing plant, seven production lines, and reported fulfillment within 15 working days off-season and one month during peak season. The supplier also lists a broad laser-equipment portfolio and exports to multiple global regions.