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8-Inch SUS420J2 Wafer Dicing Frame for Semiconductor Applications
US$2.00-10.00
100 Pieces
Sample price:US$10.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursFunction
Abrasion Resistance, Lubrication, High Temperature Resistance, Abrasion Resistance, Lubrication, High Temperature ResistanceModel NO.
WR-01Demoulding
Pull CoreCondition
NewCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
<300,000 ShotsDemoulding
Pull CoreCondition
NewCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
<300,000 ShotsAfter-Sales Service
7*24 HoursMaterial
MetalType
CaseSize
SmallWaterproof
Not WaterproofHardness
Medium SoftGender
UnisexUsage
WaferInside Material
Stainless SteelLogo Printing
CustomizedColor
SilverItem Name
Water Ring Frame; 6" 8" 12" Steel Metal Wafer FramPhysical Material
Dura420; SUS420J2; Stainless Steel; MetalSample Hardness
HRC48-55, HRC47Flatness
<0.2mm; 0.2mm or Less (for 6"/8")Surface Treatment
Mechanical PolishingApplication
Semiconductor Laboratory Equipment; SemiconductorCustomized Service
CustomizedMarking and Logi
CustomizedTransport Package
CrateSpecification
6, 8, 10, 12 inchTrademark
HimalayaOrigin
ChinaProduction Capacity
10000Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.55h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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