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Advanced 200W SMT Stencil Laser Cutting Machine for Precision
US$50,000.00-100,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

7*24 Hours

Warranty

12 Months

Model NO.

HM003

Product Name

Fiber Laser Cutting Machine

Configuration

4-Axis

Graphic Format Supported

Plt, Dxf, BMP, Dst

Laser Source Brand

Ipg

Laser Power Options

150W, 200W

Cooling System

Air-Cooled

Working/Cutting Area

800mm * 800mm

Max Cutting Speed

120 M/Min

Cutting Materials

Stainless Steel, Carbon Steel, Aluminum

Power Supply

220V, 50Hz

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

200

Key features

High-Accuracy Cutting: 800mm x 800mm working area with 120 m/min max speed for precision sheet metal fabrication.
Flexible Laser Power: Available in 150W or 200W options to handle various cutting thicknesses efficiently.
Premium Laser Components: Equipped with IPG laser source and Raytools laser head for reliable continuous wave operation.
Multi-Material Support: Capable of cutting stainless steel, carbon steel, and aluminum with high efficiency.
Stable 4-Axis Structure: 2000 KG weight ensures stability and reduces vibration during high-speed operations.
Comprehensive Warranty: Includes a 1-year warranty covering mechanical defects and machinery test report.
24/7 Technical Support: Online video support available around the clock for immediate assistance.
Versatile Graphic Support: Supports PLT, DXF, BMP, and Dst formats for flexible design input.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.62h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What are the laser power options?
A:
The machine offers laser power options of 150W or 200W depending on your cutting thickness requirements.
Q:What materials can this machine cut?
A:
It efficiently handles stainless steel, carbon steel, and aluminum materials.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
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