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Advanced 355nm UV Laser Cutter for Precision Semiconductor Fabrication
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
ProvidedModel NO.
LCM-03Application
Aerospace Industry, Automotive IndustryCooling System
Air CoolingTechnical Class
Continuous Wave LaserApplicable Material
NonmetalStructure Type
Gantry TypeLaser Classification
Semiconductor LaserLaser Technology
Laser Control Fault CuttingCondition
NewProduct Name
Automatic Laser CuttingFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
355nm UV Laser Technology: Stable performance with good light spot and long-time stable operation.
Vacuum Absorption System: Prevents wafer movement during platform motion for enhanced stability.
Automated Loading and Unloading: Features robot carrying and automatic edge searching functions.
Flexible Customization: Customized according to needs with flexible customization options.
Efficient Software Interface: High-efficient and flexible software with a simple and concise interface.
Wide Wafer Compatibility: Applicable for 2 inch, 4 inch, 8 inch, and 12 inch wafer cutting.
Comprehensive After-Sales Support: Includes one-year warranty and 24-hour online professional technical support.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.50h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the cutting speed?
A:
The cutting speed is 100mm/s, but it varies from different products.
Q:What is the laser wavelength?
A:
The laser wavelength is 355nm for both HDZ-WUVC100 and HDZ-WUVC200 models.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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