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Advanced 355nm UV Laser Cutter for Precision Semiconductor Fabrication
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Warranty

Provided

Model NO.

LCM-03

Application

Aerospace Industry, Automotive Industry

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Nonmetal

Structure Type

Gantry Type

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

Condition

New

Product Name

Automatic Laser Cutting

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

355nm UV Laser Technology: Stable performance with good light spot and long-time stable operation.
Vacuum Absorption System: Prevents wafer movement during platform motion for enhanced stability.
Automated Loading and Unloading: Features robot carrying and automatic edge searching functions.
Flexible Customization: Customized according to needs with flexible customization options.
Efficient Software Interface: High-efficient and flexible software with a simple and concise interface.
Wide Wafer Compatibility: Applicable for 2 inch, 4 inch, 8 inch, and 12 inch wafer cutting.
Comprehensive After-Sales Support: Includes one-year warranty and 24-hour online professional technical support.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.50h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the cutting speed?
A:
The cutting speed is 100mm/s, but it varies from different products.
Q:What is the laser wavelength?
A:
The laser wavelength is 355nm for both HDZ-WUVC100 and HDZ-WUVC200 models.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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