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Advanced 355nm UV Laser System for PCB Depaneling
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
ProvidedModel NO.
UVC-01Application
Automotive Industry, PCBCooling System
Water CoolingTechnical Class
Pulse LaserApplicable Material
MetalStructure Type
Gantry TypeLaser Classification
Semiconductor LaserLaser Technology
Laser Control Fault CuttingLaser Type
UV LaserWavelength
355 NmMin Beam Diameter
<10umPulse Frequency
10 to 200 kHzOutput Power
15/20 WattsRepetition Accuracy
3 μMCooling Method
Water CoolingElectrical Connection
110 to 230 V (± 10%) 16 a, 50/60 HzDimensions
1060mm X 1000mm X 1850mmPower Consumed
6 KwTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Cold Processing Technology: 355nm UV laser minimizes heat-affected zone, preventing damage to sensitive components.
Non-Contact Cutting: Eliminates mechanical stress to prevent PCB deformation or warping during the process.
Wide Material Compatibility: Cuts FR4, FR5, CEM, polyimide, PTFE, ceramics, and performs light etching on metals.
Burr-Free Smooth Edges: Produces clean cuts without debris, micro-dust, or micro-cracks for superior finish.
SMEMA Line Compatibility: Fully compatible with automated PCB assembly line processes for seamless integration.
Flexible Customization: OEM and ODM services available with flexible customization options for specific needs.
Comprehensive Warranty: Provided warranty coverage ensures long-term reliability and support for the machine.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is the maximum cutting thickness?
A:
The machine can cut materials from 0.004' (0.1mm) up to 0.07' (1.78mm), adjustable via software for optimal results.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.
Q:What are the available payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for production?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
Q:Do you offer OEM and ODM services?
A:
Yes, we provide both OEM and ODM services with flexible customization options.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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