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Advanced 8-Inch Safety Light Curtain with Smart HMI Control
US$5,000.00-8,000.00
1 Piece
Product specifications
dicing tape mounter
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
WEM-1112Classification
Mini Laminating MachineApplication
SemiconductorDriven Type
ElectricAutomatic Grade
Semi-AutomaticMembrane Material
UV FilmPlastic Film Mulching Modes
Cold LaminatingPerformance
WaterproofWafer Size
6 Inch, 8 InchPower
500WInput Power Supply
100-240V AC 50-60HzAir Pressure
0.5-0.8 MPaFilm Type
Blue Film/UV FilmPlate Heating Temperature
0~65℃Film Thickness
0.05~0.2mmFilm Function
ManualTransport Package
Sea-FreightSpecification
57 cm × 80 cm × 142 cmTrademark
HimalayaOrigin
ChinaProduction Capacity
200Key features
Customizable Wafer Sizes: Standard 6-inch with optional 7-inch and 8-inch configurations available.
Advanced Safety System: Features light curtain protection and two-handed start interlock for operator safety.
Precision Thermal Control: Electrically heated system ensures uniform expansion and ideal tape tension.
Automated Waste Management: Integrated tape cutting and collection system for streamlined workflow.
Flexible Loading System: Manual tape and ring loading design offers operational flexibility.
Cleanroom Compatible: Robust construction designed for use in semiconductor packaging cleanrooms.
Comprehensive Warranty: Includes 1-year warranty coverage for mechanical equipment reliability.
OEM/ODM Support: Flexible customization options available for specific client requirements.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.64h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What wafer sizes are compatible with this machine?
A:
The machine is standard for 6-inch wafers, with 7-inch and 8-inch options available through customization.
Q:What safety features does the machine include?
A:
It features a safety light curtain, two-handed start interlock, and automated waste management for operator protection.
Q:Does the machine support customization?
A:
Yes, we offer flexible customization for wafer sizes, power, and other specific functional requirements.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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