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Advanced Alloy Processing Furnace for Superior Heat Treatment Solutions
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvideCondition
NewCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricProduct Name
Fully Automatic Vertical FurnaceApplication
Integrated Circuit Wafer Glue, Bpo GlueFeature 1
Fec HeatingFeature 2
Rapid Temperature RiseTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
FEC Heating Technology: Features rapid temperature rise with excellent uniformity for efficient processing.
High Throughput Capacity: Handles 8/12 inch wafers with a throughput of 75PCS per tube, totaling 150PCS.
Self-Cleaning Function: Equipped with high-temperature cleaning capabilities to ensure system cleanliness.
Advanced Atmosphere Control: Multi-channel flowmeter regulates nitrogen and oxygen intake for precise environment.
Touch Screen Interface: Integrated human-machine interface with embedded controller for easy operation.
Comprehensive Safety Protection: Includes independent over-temperature protection and oxygen content detection.
Flexible Customization: Offers flexible customization options including OEM and ODM services.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.95h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What types of wafers can this furnace process?
A:
It handles 8-inch and 12-inch wafers, suitable for IC wafer glue curing and rapid annealing.
Q:Does the machine support automated production?
A:
Yes, it features an integrated human-machine operating system for continuous automated production.
Q:What is the heating power of the furnace?
A:
The heating power is 30kW per single furnace, with a total of two furnaces.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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