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Advanced Alloy Processing Furnace for Superior Heat Treatment Solutions
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provide

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Product Name

Fully Automatic Vertical Furnace

Application

Integrated Circuit Wafer Glue, Bpo Glue

Feature 1

Fec Heating

Feature 2

Rapid Temperature Rise

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

FEC Heating Technology: Features rapid temperature rise with excellent uniformity for efficient processing.
High Throughput Capacity: Handles 8/12 inch wafers with a throughput of 75PCS per tube, totaling 150PCS.
Self-Cleaning Function: Equipped with high-temperature cleaning capabilities to ensure system cleanliness.
Advanced Atmosphere Control: Multi-channel flowmeter regulates nitrogen and oxygen intake for precise environment.
Touch Screen Interface: Integrated human-machine interface with embedded controller for easy operation.
Comprehensive Safety Protection: Includes independent over-temperature protection and oxygen content detection.
Flexible Customization: Offers flexible customization options including OEM and ODM services.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.95h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What types of wafers can this furnace process?
A:
It handles 8-inch and 12-inch wafers, suitable for IC wafer glue curing and rapid annealing.
Q:Does the machine support automated production?
A:
Yes, it features an integrated human-machine operating system for continuous automated production.
Q:What is the heating power of the furnace?
A:
The heating power is 30kW per single furnace, with a total of two furnaces.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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Supplier replies will be sent to your registered email

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