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Advanced Semiconductor Bonding Solutions for 6 to 10 Inch Devices
US$5,000.00-8,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
IC-01Classification
Mini Laminating MachineApplication
SemiconductorDriven Type
ManualAutomatic Grade
Semi-AutomaticMembrane Material
UV FilmPlastic Film Mulching Modes
Cold LaminatingPerformance
WaterproofWafer Size
6 Inch, 8 InchPower
500WInput Power Supply
100-240V AC 50-60HzAir Pressure
0.5-0.8MPaFilm Type
Blue Film/UV FilmPlate Heating Temperature
0~65℃Film Thickness
0.05~0.2mmFilm Function
ManualTransport Package
Air FreightSpecification
L933*W450*H317mmTrademark
HimalayaOrigin
ChinaProduction Capacity
200Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
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