What is the average lead time?

Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.

Is customization available?

Yes, we offer OEM/ODM services and flexible customization options.

Advanced Die Bonding Machine for Diodes and Transistors

Name: Advanced Die Bonding Machine for Diodes and Transistors
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 1965922651

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$7,000.00-70,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Condition

New

Model NO.

WBM-0131-1

Speed

Super High Speed

Precision

High Precision

Certification

RoHS, CE

Warranty

24 Months

Automatic Grade

Automatic

Type

Ultra High-speed Chip Mounter

Product Name

Die Bonding Machine

Feature

Mtba, Enhanced Track Design, Easy to Operate

Item Number

Xk-8inch

Motion (X, Y Axis)

Linear Motor, 0.5 μm Resolution

Z Axis

Linear Motor, 0.5 μm Resolution; 40 mm Travel

Die Bonding Size

0.2 mm X 0.2 mm ~ 1 mm X 1 mm

Case Size (L x W x H)

115 to 305 mm X 20 To115 mm X 50 to 200 mm

Track Temperature Zone

8 Temperature Zones

Protective Air

0.1 MPa

Transport Package

Wooden Box by Sea Shipping

Specification

standard package

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

Advanced Image Recognition: Optimized optical system and high-resolution camera enhance track design and positioning accuracy.

Easy Operation Design: Simple three-point alignment and nozzle replacement without gauge, suitable for on-site operators.

Quality Control Monitoring: Features pick tool wear monitoring, post-bond evaluation, and welding process monitoring (BPM).

Modular Maintenance: Direct drive motors and modular design reduce moving parts, simplifying maintenance and improving reliability.

Flexible Customization: Supports OEM/ODM services with flexible customization options for specific machine requirements.

Wide Compatibility: Handles die bonding sizes from 0.2x0.2mm to 1x1mm and supports lead frames up to 100mm width.

CE and RoHS Certified: Equipment meets international safety and environmental standards with CE and RoHS certifications.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.77h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing.

Q:What is the minimum order quantity?

The minimum order quantity is 1 set.

Q:What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.