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Advanced Diffusion Systems for Versatile Vertical and Horizontal Use
US$40,000.00-100,000.00
1 Piece

Product profile

Customization

Available

Laser Visibility

Visible

Applicable Material

Nonmetal

Model NO.

HIMALAYA-258

Cooling System

Air Cooling

Technical Class

Pulse Laser

Laser Wavelength

Fiber Laser

Laser Classification

Free Electron Laser

Type

CO2 Laser Marking Machine

Marking Method

Scanning Marking

Feature 1

High Precision

Feature 2

High Efficiency

After-Sale Service

Provided

Application

IC, Mems, Power Devices, Nanotechnology, LED

Primary Processes

Oxidation, Diffusion, Alloy, Annealing

Wafer Size Compatibility

2" to 8" (12" Capable), 125mm/156mm/200mm Solar

Batch Capacity

1-25 Wafers/Batch

Heating Zones

3-Zone Control

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Wide Wafer Compatibility: Compatible with 2-8 inch wafers (12-inch capable) and solar cells of 125mm/156mm/200mm.
Versatile Thermal Processes: Supports oxidation, diffusion, annealing, sintering, and alloying in various atmospheres.
Compact Space-Efficient Design: Available in horizontal or vertical structures with a small footprint for laboratory use.
High Batch Capacity: Handles 1-25 wafers per batch with a boat capacity of 5-25 chips.
Advanced Safety & Control: Features automatic computer control and robust safety interlock protection systems.
Flexible Customization: Offers OEM/ODM services and flexible customization options for specific needs.
Low Maintenance Operation: Designed for easy operation, low maintenance costs, and maximized uptime.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What wafer sizes are supported?
A:
It is compatible with standard semiconductor wafers from 2 inches to 8 inches (with 12-inch capability) and various solar cell formats (125mm, 156mm, 200mm).
Q:What thermal processes can be performed?
A:
The system supports oxidation, diffusion, alloying, annealing, sintering, and other processes in nitrogen and hydrogen atmospheres.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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