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Advanced Dual-Line Grinding Machine for Perfect Surface Finishing
US$100,000.00-500,000.00
1 Piece

Product profile

Customization

Available

Certification

ISO9001

Protection

Shock Resistance

Model NO.

HL-235A

Installation

Hanging

Housing

Fibre Glass

Applied to

Solar Wafer Process

Operation

Automatic

Grinding Length

200–950 mm

Processing Margin

150–230 mm

Chamfering

R5

Size Tolerance

±0.05 mm

Flatness

≤0.05 mm

Parallelism

≤0.05 mm

Transport Package

Wooden Cage

Specification

25T

Trademark

Himalaya

Origin

China

HS Code

8541590000

Production Capacity

200

Key features

Dual-Line Processing: Processes two workpieces simultaneously to increase throughput and efficiency.
Multi-Stage Machining: Supports rough grinding, precision grinding, chamfering, and rounding in one setup.
Automated Adjustability: Programmable settings for grit size, feed rate, pressure, and coolant flow.
Real-Time Monitoring: Monitors grinding force, temperature, and vibration to prevent defects.
ISO9001 Certified: Manufacturing process meets international quality management standards.
Shock Resistance: Fiber glass housing provides protection against mechanical shocks.
OEM/ODM Service: Flexible customization available for specific production requirements.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.93h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the available payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for delivery?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
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