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Advanced Dual Platform Laser Cutting and Engraving Machine
US$10,000.00-200,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
YesWarranty
12 MonthsModel NO.
HM001Laser Visibility
InvisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
Fiber LaserLaser Classification
Fiber LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingWavelength
532nmAdvantage
Minimize Heat-Affected ZonesCutting Material
Brittle or Heat-Sensitive MaterialsWork Area
250mm × 500mmAccuracy
±0.02mm (20µM)Dimensions
1700mm (L) × 1650mm (W) × 1850mm (H)Weight
2000kgPower Requirement
2.5kwHumidity
30%–60% (Non-Condensing)Temperature
22°C ± 2°CTransport Package
Air FreightSpecification
customizedTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
Picosecond Green Laser: 532nm wavelength with ultra-short pulses minimizes heat-affected zones.
Zero Thermal Damage: Ablates material without melting edges, ideal for OLEDs and wafers.
Customizable Work Area: Standard 250mm x 500mm adaptable to larger sizes for production runs.
Dual Platform Efficiency: Dual platform design significantly improves processing efficiency.
Automatic Target Finding: Realizes arbitrary fiducial setting and automatic expansion compensation.
Robust Mechanical Design: Heavy-duty 2000kg frame minimizes vibration for stable operation.
Flexible Customization: OEM and ODM services available with flexible customization options.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.68h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for delivery?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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