Advanced Dual-Sided Laser Engraving Machine for PCB Designs

Name: Advanced Dual-Sided Laser Engraving Machine for PCB Designs
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2124800945

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$1,000.00-7,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Warranty

Provided

Model NO.

PCBA-01

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

UV Laser, CO2 Laser

Laser Classification

Semiconductor Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Product Name

PCBA & IC & Wafer Marking Machine

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

100

Key features

CCD Positioning & Verification: Coaxial CCD system captures mark points, compensates deviation, and verifies codes via MES integration.

Automatic Alarm & Stop: Automatically alarms and stops if code errors are detected or codes cannot be read correctly.

Customized Solutions: Features customized according to needs, including PCBA, IC, and Wafer marking applications.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.22h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What is the marking method used?

The machine uses scanning marking with a double head radium carving system, utilizing CO2 laser for high-precision marking.

Q:Can the machine verify codes automatically?

Yes, it reads one-dimensional and two-dimensional codes, uploads data via MES system, and alarms if errors are detected.