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Advanced Eutectic Die Bonder for Precision Semiconductor Assembly
US$18,000.00-200,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Online ServiceFunction
High Temperature ResistanceModel NO.
HMLA-LS03Demoulding
AutomaticCondition
NewCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsChip Size
≤1.5mmSubstrate Size
0.15 to 4mmVelocity
70sPatch Pressure
10g to 100gXy Placement Accuracy
+/- 1.5umDie Rotation Accuracy
0.3deg @3sigmaFov
4X LensHeating Method
Pulse HeatingTemp. Accuracy
+/- 5 DegTransport Package
Air FreightSpecification
0*0*0Trademark
HimalayaOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.10h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
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