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Advanced GaN Polishing Tools for High-Quality Sic Wafer Production
US$50,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursFunction
Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-ColdModel NO.
WCD-1211Demoulding
AutomaticCondition
NewCertification
RoHS, CEWarranty
12 MonthsAutomatic Grade
SemiautomaticInstallation
DesktopDriven Type
PneumaticMould Life
>1,000,000 ShotsMechanical Configuration
3-Platen + 4-Head SystemCleaning Technology
Dual-Brush Cleaning (PVA + Nylon)Wafer Handling
Dry-in/Dry-out ProcessUniformity Control
Wiw/Wtw <5%Removal Rate (Rr) & Uniformity
Oxide: Nu <3%Advanced Material Support
Sic/GaN CompatibleHorizon-T 200CMP (Oxide)
Throughput: 45 WphIndustry Application
5g / RF Ics/Power Devices (Sic/IGBT)Transport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
High Throughput Performance: WPH exceeds 60, significantly higher than comparable international imported equipment.
Superior Uniformity Control: Opposing head/table configuration ensures WIW & WTW uniformity is less than 3%.
Advanced CMP System: Designed for mainstream 14nm/28nm logic processes including STI, ILD, IMD, and FinFET.
Dual Independent Systems: Features 2x2 polishing tables and dual cleaning stations for parallel, independent operation.
Precision Temperature Control: Infrared temperature measurement system maintains constant polishing plate temperature.
Automatic Dry Workflow: Fully automatic loading and unloading with a dry-in, dry-out process workflow.
Flexible Customization: OEM, ODM, and designing services available for mechanical configuration and cleaning tech.
Robust Material Support: Compatible with SiC/GaN wafers and supports oxide removal with Nu less than 3%.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.85h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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