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Advanced Glass Wafer Handling and Laser Cutting Solutions
US$500,000.00-1,500,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
ProvidedFunction
High Temperature ResistanceDemoulding
AutomaticCondition
UsedCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
DesktopDriven Type
ElectricMould Life
>1,000,000 ShotsProduct Name
Glass Wafer Laser Processing EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsOEM/ODM Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Ultrafast Laser Precision: Uses ultrafast laser technology for precision drilling of brittle materials with high efficiency.
Fully Automatic Operation: Features automatic loading, unloading, and waste collection for large-scale production.
Surface Protection Design: Utilizes PEEK fixtures and engineering plastic suction cups to minimize surface scratches.
High Mould Durability: Engineered for a mould life exceeding 1,000,000 shots for long-term reliability.
Flexible Customization: Offers OEM/ODM services and customized solutions according to specific customer needs.
24/7 Technical Support: Provides round-the-clock telephone technical support and professional online assistance.
ISO Certified Quality: Manufactured under ISO certification standards ensuring consistent product quality.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.34h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for production?
A:
Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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