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Advanced High Efficiency Wire Bonding Bonder Machine for Precision Assembly
US$50,000.00-400,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Online ServiceWarranty
1 YearModel NO.
HM001Bond Strength
Complies with Gjb548b-2005 Method 2011.1Wire Diameter Range
φ18–50 μmXyz Axis Repeat Accuracy
±3 μmWelding Range
150 × 150 mmWelding Pressure Range
5GF–150GFMax Cavity Depth
10 mmHeating Table Temperature
up to 200°CUltrasonic Power
0–10 WTransport Package
Air FreightSpecification
customizedTrademark
HimalayaOrigin
ChinaProduction Capacity
200Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.93h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
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Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
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