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Advanced Laser Grooving Technology for Precision Wafer Cutting
US$65,000.00-75,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
HMLA-5380Applicable Materials
Low-K, Metal, Ceramic, Glass, etcLaser Type
DPSS Ultraviolet LaserLaser Power
≥5WCooling Method
Closed-Loop Water CoolingGrooving Depth
>10μmCutting-Axis Speed
0-800mm/STransport Package
Wooden CaseSpecification
customizedTrademark
HimalayaOrigin
ChinaKey features
High-Precision Grooving: Achieves 0.01mm surface precision over 300mm span for 40nm nodes.
Wide Material Support: Processes low-k dielectrics, metals, ceramics, and glass up to 12 inches.
Yield Improvement: Reduces edge collapse and delamination to improve wafer yield.
Adjustable Parameters: Grooving width and depth are adjustable for specific process needs.
ISO 9001 Certified: Manufactured under ISO 9001 with 6 registered utility model patents.
Full Customization: Supports OEM, ODM, and private-label equipment production.
Automated System: Fully automated with auto-focusing and point light source illumination.
Global Logistics: Shipped via air, sea, or railway in ISPM-15 compliant wooden crates.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.62h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is the warranty period for this equipment?
A:
The equipment comes with a 1-year warranty and 1-year after-sales service.
Q:What types of materials can this laser grooving system process?
A:
It is suitable for low-k dielectrics, metals, ceramics, and glass.
Q:What is the maximum wafer size supported?
A:
The system supports wafers up to 12 inches (300mm) in size.
Q:Is customization available for this machine?
A:
Yes, we offer OEM, ODM, and flexible customization for product development and brand customization.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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