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Advanced Laser Solutions for Enhanced Semiconductor Manufacturing Processes
US$70,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedFunction
Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-ColdModel NO.
LIE-1104Demoulding
AutomaticCondition
NewCertification
RoHS, CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
>1,000,000 ShotsProduct Name
Laser Induced Epitaxial Growth MachineFeature 1
Modulation TechnologyFeature 2
High ProductivityOEM/ODM Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
First Domestic 12 Inch Mass Production: Advanced laser induced epitaxial growth equipment for 12-inch wafer mass production.
High Precision Beam Technology: Features high precise beam combination and modulation technology for rectangular top-hat beams.
High Energy Density Accuracy: Achieves energy density accuracy down to 5mJ/cm2 for superior process control.
Superior Beam Uniformity: Ensures beam top uniformity of less than 1% for consistent results.
Extended Mould Life: Designed for over 1,000,000 shots to ensure long-term operational stability.
Comprehensive Certification: Meets RoHS and CE standards for safety and environmental compliance.
Flexible Customization Options: Offers flexible customization with OEM and ODM services available.
Advanced Application Capabilities: Specialized for crystallization and void elimination in ultra-small vias with large aspect ratios.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.
Q:What are the available payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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