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Advanced Laser Technology for Superior PCB Marking Systems
US$100,000.00-300,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursWarranty
12 MonthsModel NO.
PCBA-02Laser Visibility
VisibleApplicable Material
NonmetalCooling System
Air CoolingTechnical Class
Pulse LaserLaser Wavelength
CO2 LaserLaser Classification
Free Electron LaserType
CO2 Laser Marking MachineMarking Method
Scanning MarkingProduct Name
Dedicated Laser Precision Marking EquipmentModel Number
Hdz-Sic100Product Specification
L: 160-320mm; W: 30-80mmAfter-Sale Service
ProvidedMarking Scope
320mm*160mmFinal Processing Repeated Positioning
±0.1mmUph
1200 Pieces/H (Idle)Power Supply
AC 220V, 50/60HzAir Source
0.6-0.8 MPaOverall Dimension
2525mm*1665mm*2000mmTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
High-Speed Marking: Achieves 1200 pieces/hour idle speed for efficient PCB production.
Dual-Side Capability: Supports top and bottom processing with optional board flipping device.
SMT Line Integration: Fully automatic loading/unloading compatible with SMEMA standard.
Versatile Laser Options: Offers CO2, UV, green, and fiber lasers for various nonmetal materials.
CE & SEMI Certified: Complies with CE MARK and SEMI standards for industrial safety.
MES System Connectivity: Connects with customer MES for data reading and traceability.
Fume Removal System: Special device quickly extracts fume and dust to protect environment.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.07h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What is the marking speed?
A:
The equipment achieves an idle speed of 1200 pieces per hour.
Q:Does it support dual-side marking?
A:
Yes, it works with board flippers for top and bottom processing.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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