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Advanced Laser Wafer Marking System for Semiconductor Production
US$100,000.00-500,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Online Service

Warranty

12 Months

Model NO.

HMLY-DB-005

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Pulse Laser

Laser Wavelength

Fiber Laser

Laser Classification

Semiconductor Laser

Type

Semiconductor Laser Marking Machine

Marking Method

Scanning Marking

Speed

Optimized Throughput for Production Lines

Sub-Micron Accuracy

Precision Alignment for <10μm Marks

Material Versatility

Processes Si, GaAs, Sic, and Compound Wafers

Traceability Compliance

Semi T7 & Secs/Gem Standards

Smart Vision Options

Auto-Focus and Pre/Post-Mark Inspection

Application

Wafer-Level Die Identification

Laser Wave

355nm

Laser Power

4W / 7W / 10W /15W / 25W

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Sub-Micron Accuracy: Precision alignment for marks under 10 microns with 10 microns resolution.
SECS/GEM Compatibility: Supports SECS/GEM communication for seamless factory integration.
Cleanroom Ready: Maintains ISO Class 2 cleanliness with optional FFU and dust extraction.
Multi-Laser Options: Available in 355nm UV, 532nm Green, and 1064nm Fiber laser types.
Customizable Patterns: Supports DXF/PLT formats for custom barcodes, QR codes, and alphanumeric IDs.
Fast Auto-Calibration: 3-second center and angle detection ensures accurate positioning.
Broad Material Support: Processes Si, GaAs, SiC, GaN, Sapphire, Glass, and Ceramics wafers.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:What is a Wafer Marking Machine?
A:
It's a high-precision laser system designed to permanently mark wafers (Si, GaN, SiC, sapphire, etc.) with barcodes, QR codes, alphanumeric IDs, or custom patterns for traceability in semiconductor, LED, and MEMS manufacturing.
Q:What industries use this machine?
A:
Semiconductor fabs (Si, GaAs, GaN, SiC), LED & optoelectronics (Mini/Micro-LEDs), Solar/PV manufacturing, MEMS & advanced packaging, Medical devices & bioelectronics, and Automotive power modules.
Q:What types of lasers are used?
A:
Fiber Lasers (1064 nm) for metals & hard materials (Si, SiC), UV Lasers (355 nm) for delicate wafers (GaN, sapphire) with minimal heat impact, and Green Lasers (532 nm) for glass, ceramics, and thin-film solar cells.
Q:What is the warranty period?
A:
We provide a 12-month warranty for the machine.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.

Send Inquiry

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