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Advanced Laser Wafer Marking System for Semiconductor Production
US$100,000.00-500,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Online ServiceWarranty
12 MonthsModel NO.
HMLY-DB-005Laser Visibility
VisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Pulse LaserLaser Wavelength
Fiber LaserLaser Classification
Semiconductor LaserType
Semiconductor Laser Marking MachineMarking Method
Scanning MarkingSpeed
Optimized Throughput for Production LinesSub-Micron Accuracy
Precision Alignment for <10μm MarksMaterial Versatility
Processes Si, GaAs, Sic, and Compound WafersTraceability Compliance
Semi T7 & Secs/Gem StandardsSmart Vision Options
Auto-Focus and Pre/Post-Mark InspectionApplication
Wafer-Level Die IdentificationLaser Wave
355nmLaser Power
4W / 7W / 10W /15W / 25WTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
50000Key features
Sub-Micron Accuracy: Precision alignment for marks under 10 microns with 10 microns resolution.
SECS/GEM Compatibility: Supports SECS/GEM communication for seamless factory integration.
Cleanroom Ready: Maintains ISO Class 2 cleanliness with optional FFU and dust extraction.
Multi-Laser Options: Available in 355nm UV, 532nm Green, and 1064nm Fiber laser types.
Customizable Patterns: Supports DXF/PLT formats for custom barcodes, QR codes, and alphanumeric IDs.
Fast Auto-Calibration: 3-second center and angle detection ensures accurate positioning.
Broad Material Support: Processes Si, GaAs, SiC, GaN, Sapphire, Glass, and Ceramics wafers.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is a Wafer Marking Machine?
A:
It's a high-precision laser system designed to permanently mark wafers (Si, GaN, SiC, sapphire, etc.) with barcodes, QR codes, alphanumeric IDs, or custom patterns for traceability in semiconductor, LED, and MEMS manufacturing.
Q:What industries use this machine?
A:
Semiconductor fabs (Si, GaAs, GaN, SiC), LED & optoelectronics (Mini/Micro-LEDs), Solar/PV manufacturing, MEMS & advanced packaging, Medical devices & bioelectronics, and Automotive power modules.
Q:What types of lasers are used?
A:
Fiber Lasers (1064 nm) for metals & hard materials (Si, SiC), UV Lasers (355 nm) for delicate wafers (GaN, sapphire) with minimal heat impact, and Green Lasers (532 nm) for glass, ceramics, and thin-film solar cells.
Q:What is the warranty period?
A:
We provide a 12-month warranty for the machine.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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