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Advanced Micro LED Wafer Laser Transfer Automation Solution
US$500,000.00-800,000.00
1 Piece

Product profile

Customization

Available

Application

Detector, Temperature Measurement

Batch Number

2022+

Model NO.

HM-02

Certification

CE, RoHS

Manufacturing Technology

Logic IC

Material

Power Semiconductor

Model

PC817

Package

BGA

Signal Processing

Analog Digital Composite and Function

Type

Intrinsic Semiconductor

Product Name

Micro LED Wafer Laser Mass Transfer System

Stroke Range

X/Y: 400 mm

Stroke Range 2

Z: 20 mm

Material Compatibility

Micro-LED-Specific Substrates

Automation

Fully Automated RGB Loading/Unloading

Scalability

Compatible with Roll-to-Roll (R2r)

Laser Type

UV/Excimer Lasers

Flexible Displays

Supports Curved/Foldable Screens

Transport Package

Packed with Wooden Box by Sea Shipping

Specification

1500kg

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

Fully Automated Operation: Features fully automatic three-color loading and unloading for high efficiency.
Customized Product Size: Processed product size is tailored according to specific customer requirements.
Flexible Customization: Offers flexible customization options for ODM and OEM services.
High Yield Performance: Designed for high yield and high efficiency in micro-LED mass transfer.
Roll-to-Roll Scalability: Compatible with Roll-to-Roll (R2r) processes for scalable production.
Curved Display Support: Supports curved and foldable screens for flexible display applications.
UV/Excimer Laser Type: Utilizes UV/Excimer lasers for precise micro-LED device transfer.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.93h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:Can the product size be customized?
A:
Yes, the size of processed products is tailored according to customer requirements.
Q:Is OEM and ODM service available?
A:
Yes, both OEM and ODM services are available with flexible customization options.
Q:What are the lead times for production?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What payment terms are accepted?
A:
Accepted payment terms include LC, T/T, PayPal, and Western Union.

Send Inquiry

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