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Advanced Micro LED Wafer Laser Transfer Automation Solution
US$500,000.00-800,000.00
1 Piece
Product profile
Customization
AvailableApplication
Detector, Temperature MeasurementBatch Number
2022+Model NO.
HM-02Certification
CE, RoHSManufacturing Technology
Logic ICMaterial
Power SemiconductorModel
PC817Package
BGASignal Processing
Analog Digital Composite and FunctionType
Intrinsic SemiconductorProduct Name
Micro LED Wafer Laser Mass Transfer SystemStroke Range
X/Y: 400 mmStroke Range 2
Z: 20 mmMaterial Compatibility
Micro-LED-Specific SubstratesAutomation
Fully Automated RGB Loading/UnloadingScalability
Compatible with Roll-to-Roll (R2r)Laser Type
UV/Excimer LasersFlexible Displays
Supports Curved/Foldable ScreensTransport Package
Packed with Wooden Box by Sea ShippingSpecification
1500kgTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
Fully Automated Operation: Features fully automatic three-color loading and unloading for high efficiency.
Customized Product Size: Processed product size is tailored according to specific customer requirements.
Flexible Customization: Offers flexible customization options for ODM and OEM services.
High Yield Performance: Designed for high yield and high efficiency in micro-LED mass transfer.
Roll-to-Roll Scalability: Compatible with Roll-to-Roll (R2r) processes for scalable production.
Curved Display Support: Supports curved and foldable screens for flexible display applications.
UV/Excimer Laser Type: Utilizes UV/Excimer lasers for precise micro-LED device transfer.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.93h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:Can the product size be customized?
A:
Yes, the size of processed products is tailored according to customer requirements.
Q:Is OEM and ODM service available?
A:
Yes, both OEM and ODM services are available with flexible customization options.
Q:What are the lead times for production?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What payment terms are accepted?
A:
Accepted payment terms include LC, T/T, PayPal, and Western Union.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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